LED PCB Board High Density Electronics PCB Components Assembly

LED PCB Board High Density Electronics PCB Components Assembly

Specifications

Product name: Display products PCBA
Layers: 2L
Thickness: 1.6mm
Copper finished: 1OZ
Process description: SMT+DIP
The smallest components package: 0603
RoHS standard: Yes

Huaswin specialized in PCB manufacturing and and PCB Assembly

PCBA capabilities:

1. Provide turn-key solution of electronic product with high cost-effectiveness

2. PCBA and enclosure design

3. PCBA,PCB assembly:SMT&PTH&BGA

4. Component sourcing and purchasing

5. Quick prototyping

6. Plastic injection molding

7. Metal sheet stamping

8. Final assembly

9. Test:AOI,In-Circuit Test(ICT),Functional Test(FCT)

10. Support various certification such as UL/ISO/SGS

11. High mix and low/medium volume are accepted

Quality Assurance:

ISO9001 and ISO/TS16949 management systems
Lean production system
ERP and PTS system support for management

Quality Processes:

1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949

Testing:

AOI (Automatic optical inspection)
ICT(In-circuit test)
Reliability test
X-Ray Test
Analogue and digital function test
Firmware programming


Rich experience for SUPPLY CHAIN MANAGEMENT for components, moldings, stamping, plastic injection parts etc.

Contat us for your RFQ!

printed circuit assembly

automated pcb assembly

LED PCB Board High Density Electronics PCB Components Assembly Images